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    C550 3D Mesh Supernode

    Introduction

    The C550 3D Mesh Supernode, developed by MetaX and its partners, delivers powerful multi-precision computing capabilities. It supports 3D Mesh topology with low-cost, low-latency electrical interconnection for a supernode of up to 8 servers and 64 cards. It perfectly supports ultra-large-scale computing centers, general-purpose computing, and data processing applications.

    Product Features

    Standard OAM server featuring self-developed GPGPU and mainstream CPU
    Single supernode supports 64-card in-memory semantic electrical interconnect with ultra-low communication latency
    3D mesh architecture with open bus technology enables hyperscale data center deployment
    Full-stack solution from chip to cabinet for rapid deployment
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